Item type |
学術雑誌論文 / Journal Article(1) |
公開日 |
2007-05-08 |
タイトル |
|
|
言語 |
en |
|
タイトル |
Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers |
言語 |
|
|
言語 |
eng |
資源タイプ |
|
|
資源 |
http://purl.org/coar/resource_type/c_6501 |
|
タイプ |
journal article |
アクセス権 |
|
|
アクセス権 |
open access |
|
アクセス権URI |
http://purl.org/coar/access_right/c_abf2 |
著者 |
Yan, Jiwang
Takahashi, Hirokazu
Tamaki, Jun-ichi
Gai, Xiaohui
Kuriyagawa, Tsunemoto
|
抄録 |
|
|
内容記述タイプ |
Abstract |
|
内容記述 |
Nanoindentation tests were performed on a ductile-machined silicon wafer with a Berkovich diamond indenter, and the resulting indents were examined with a transmission electron microscope. It was found that the machining-induced subsurface amorphous layer undergoes significant plastic flow, and the microstructure of the indent depends on the indentation load. At a small load (~20 mN),most of the indented region remains to be amorphous with minor crystalline nuclei; while under a large load (~50 mN),the amorphous phase undergoes intensive recrystallization. The understanding and utilization of this phenomenon might be useful for improving the microscopic surface properties of silicon parts produced by a ductile machining process. |
書誌情報 |
Applied physics letters
巻 87,
p. 211901-1-211901-3,
発行日 2005-11
|
DOI |
|
|
|
識別子タイプ |
DOI |
|
|
関連識別子 |
http://doi.org/10.1063/1.2133908 |
権利 |
|
|
権利情報 |
The following article appeared in C.C. Hsu, J.H. Lin, T.H. Huang, K. Harada, Applied Physics Letters, 87, 211901-1-211901-3, (2005) and may be found at http://link.aip.org/link/?apl/87/211901-1. |
権利 |
|
|
権利情報 |
Copyright 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. |
出版者 |
|
|
出版者 |
American Institute of Physics |
著者版フラグ |
|
|
値 |
publisher |
出版タイプ |
|
|
出版タイプ |
VoR |
|
出版タイプResource |
http://purl.org/coar/version/c_970fb48d4fbd8a85 |