@article{oai:kitami-it.repo.nii.ac.jp:00006970,
 author = {Yan, Jiwang and Takahashi, Hirokazu and Tamaki, Jun-ichi and Gai, Xiaohui and Kuriyagawa, Tsunemoto},
 journal = {Applied physics letters},
 month = {Nov},
 note = {Nanoindentation tests were performed on a ductile-machined silicon wafer with a Berkovich　diamond indenter, and the resulting indents were examined with a transmission electron microscope. It was found that the machining-induced subsurface amorphous layer undergoes significant plastic flow， and the microstructure of the indent depends on the indentation load. At a small load (～20 mN)，most of the indented region remains to be amorphous with minor crystalline nuclei; while under a large load (～50 mN)，the amorphous phase undergoes intensive recrystallization. The understanding and utilization of this phenomenon might be useful for improving the microscopic surface properties of silicon parts produced by a ductile machining process.},
 pages = {211901-1--211901-3},
 title = {Transmission electron microscopic observation of nanoindentations made on ductile-machined silicon wafers},
 volume = {87},
 year = {2005}
}