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Effects of Nb Surface and Ti Interface Layers on Thermal Stability and Electrical Resistivity of Ag Thin Films
https://kitami-it.repo.nii.ac.jp/records/8463
https://kitami-it.repo.nii.ac.jp/records/8463c91ce019-4580-4d8d-9f39-7cfb69481d3b
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
No.11-Kawamura.pdf (779.1 kB)
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| Item type | 学術雑誌論文 / Journal Article(1) | |||||
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| 公開日 | 2016-09-08 | |||||
| タイトル | ||||||
| タイトル | Effects of Nb Surface and Ti Interface Layers on Thermal Stability and Electrical Resistivity of Ag Thin Films | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | journal article | |||||
| アクセス権 | ||||||
| アクセス権 | open access | |||||
| アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||
| 著者 |
Zhang, Ziyang
× Zhang, Ziyang× Kawamura, Midori× Abe, Yoshio× Kim, Kyung Ho |
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| 著者別名 | ||||||
| 識別子Scheme | WEKO | |||||
| 識別子 | 44880 | |||||
| 識別子Scheme | KAKEN | |||||
| 識別子URI | https://nrid.nii.ac.jp/ja/nrid/1000070261401 | |||||
| 識別子 | 70261401 | |||||
| 姓名 | 川村, みどり | |||||
| 言語 | ja | |||||
| 著者別名 | ||||||
| 識別子Scheme | WEKO | |||||
| 識別子 | 44879 | |||||
| 識別子Scheme | KAKEN | |||||
| 識別子URI | https://nrid.nii.ac.jp/ja/nrid/1000020261399 | |||||
| 識別子 | 20261399 | |||||
| 姓名 | 阿部, 良夫 | |||||
| 言語 | ja | |||||
| 著者別名 | ||||||
| 識別子Scheme | WEKO | |||||
| 識別子 | 44878 | |||||
| 識別子Scheme | KAKEN | |||||
| 識別子URI | https://nrid.nii.ac.jp/ja/nrid/1000070608471 | |||||
| 識別子 | 70608471 | |||||
| 姓名 | 金, 敬鎬 | |||||
| 言語 | ja | |||||
| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | Nb/Ag, Ag/Ti, and Nb/Ag/Ti films were prepared by rf magnetron sputtering to investigate the effects of the Nb surface and Ti interface layers on the thermal stability and electrical resistivity of 100-nm-thick Ag thin films. The Nb surface layer, regardless of the chemical state of metal or oxide, prevented the migration of Ag atoms during annealing, which contributed to the agglomeration suppression of Ag films. Ti interface layers not only improved the adhesion of Ag films to SiO2 substrates but also impelled the overcoated Ag atoms to arrange along the close-packed plane (111); thus, Ag/Ti films exhibited relatively good thermal stability and low resistivity. By combining the roles of the Nb surface and Ti interface layers, Nb (5 nm)/Ag (100 nm)/Ti (3 nm) films showed the highest thermal stability and the lowest resistivity. Different materials of surface and interface layers might be more effective for improving the thermal stability and electrical resistivity of Ag films. | |||||
| 書誌情報 |
en : Japanese Journal of Applied Physics 巻 51, 号 8, p. 085802, 発行日 2012 |
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| 権利 | ||||||
| 権利情報 | c 2012 The Japan Society of Applied Physics | |||||
| 出版者 | ||||||
| 出版者 | Japan Society of Applied Physics | |||||
| 著者版フラグ | ||||||
| 値 | author | |||||
| 出版タイプ | ||||||
| 出版タイプ | AM | |||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
