| Item type |
学術雑誌論文 / Journal Article(1) |
| 公開日 |
2007-05-08 |
| タイトル |
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タイトル |
Nanoindentation tests on diamond-machined silicon wafers |
|
言語 |
en |
| 言語 |
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|
言語 |
eng |
| 資源タイプ |
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資源 |
http://purl.org/coar/resource_type/c_6501 |
|
タイプ |
journal article |
| アクセス権 |
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アクセス権 |
open access |
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アクセス権URI |
http://purl.org/coar/access_right/c_abf2 |
| 著者 |
Yan, Jiwang
Takahashi, Hirokazu
Tamaki, Jun-ichi
Gai, Xiaohui
Harada, Hirofumi
Patten, John
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| 抄録 |
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内容記述タイプ |
Abstract |
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内容記述 |
Nanoindentation tests were performed on ultraprecision diamond-turned silicon wafers and the results were compared with those of pristine silicon wafers. Remarkable differences were found between the two kinds of test results in terms of load-displacement characteristics and indent topologies. The machining-induced amorphous layer was found to have significantly higher microplasticity and lower hardness than pristine silicon. When machining silicon in the ductile mode, we are in essence always machining amorphous silicon left behind by the preceding tool pass; thus, it is the amorphous phase that dominates the machining performance. This work indicated the feasibility of detecting the presence and the mechanical properties of the machining-induced amorphous layers by nanoindentation. |
| 書誌情報 |
Applied Physics Letters
巻 86,
p. 181913-1-181913-3,
発行日 2005-05
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| DOI |
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識別子タイプ |
DOI |
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関連識別子 |
http://doi.org/10.1063/1.1924895 |
| 権利 |
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|
権利情報 |
The following article appeared in J.Yan, H.Takahashi, J.Tamaki, X.Gai, H.Harada, J.Patten, Applied Physics Letters, 86, 181913-1-181913-3, (2005) and may be found at http://link.aip.org/link/?apl/86/181913-1. |
| 権利 |
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|
権利情報 |
Copyright 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. |
| 出版者 |
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出版者 |
American Institute of Physics |
|
言語 |
en |
| 著者版フラグ |
|
|
言語 |
en |
|
値 |
publisher |
| 出版タイプ |
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出版タイプ |
VoR |
|
出版タイプResource |
http://purl.org/coar/version/c_970fb48d4fbd8a85 |
4101.pdf (3.2 MB)
