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  1. 学術雑誌論文
  2. 洋雑誌

Sputter-deposition of Ag films in a nitrogen discharge

https://kitami-it.repo.nii.ac.jp/records/7275
https://kitami-it.repo.nii.ac.jp/records/7275
97474566-f151-494a-ae44-9eae04cbcc2c
名前 / ファイル ライセンス アクション
tsf515_540-.pdf tsf515_540-.pdf (114.0 kB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2008-03-12
タイトル
タイトル Sputter-deposition of Ag films in a nitrogen discharge
言語 en
言語
言語 eng
キーワード
主題Scheme Other
主題 Crystal orientation
キーワード
主題Scheme Other
主題 Ag film
キーワード
主題Scheme Other
主題 rf sputtering
キーワード
主題Scheme Other
主題 Interaction between nitrogen and metal
キーワード
主題Scheme Other
主題 XRD
キーワード
主題Scheme Other
主題 Electrical resistivity
資源タイプ
資源 http://purl.org/coar/resource_type/c_6501
タイプ journal article
アクセス権
アクセス権 open access
アクセス権URI http://purl.org/coar/access_right/c_abf2
著者 Kawamura, Midori

× Kawamura, Midori

en Kawamura, Midori

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Abe, Yoshio

× Abe, Yoshio

en Abe, Yoshio

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Sasaki, Katsutaka

× Sasaki, Katsutaka

en Sasaki, Katsutaka

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抄録
内容記述タイプ Abstract
内容記述 In general, the presence of a reactive gas in the sputtering atmosphere must be avoided to prevent the formation of any other phases during the preparation of metal films. However, we hypothesized that films of metals, which do not form a nitride phase, could be prepared even in 100% nitrogen. Ag films were sputter-deposited in nitrogen and characterized. We found that it is feasible to obtain pure Ag films by rf sputtering in a nitrogen discharge. No other phase but Ag was detected by X-ray diffraction (XRD) analysis and nitrogen was not detected in the film by Auger electron spectroscopy. Electrical resistivity was also as low as 2.8 I?Ic cm. Moreover, we found that Ag films thus deposited at a substrate temperature of 100 A°C exhibited preferential orientation of (100), though that of (111) is generally observed in films sputtered in Ar. At other substrate temperatures, the degree of (100) orientation decreased. Consequently, we have found that sputter-deposition by the present method is useful for preparing pure Ag films with texture controlled by selecting the appropriate conditions.
内容記述
内容記述タイプ Other
内容記述 NOTICE: This is the author's version of a work accepted for publication by Elsevier. Changes resulting from the publishing process, including peer review, editing, corrections, structual formatting and other quality control mechanisms , may not be reflected in this document. Changes may have been to this work since it was submitted for publication.
書誌情報 Thin Solid Films

巻 515, 号 2, p. 540-542, 発行日 2006-10
DOI
識別子タイプ DOI
関連識別子 http://doi.org/10.1016/j.tsf.2005.12.292
フォーマット
内容記述タイプ Other
内容記述 application/pdf
出版者
出版者 Elsevier
言語 en
著者版フラグ
言語 en
値 author
出版タイプ
出版タイプ AM
出版タイプResource http://purl.org/coar/version/c_ab4af688f83e57aa
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