2024-03-29T08:12:16Z
https://kitami-it.repo.nii.ac.jp/oai
oai:kitami-it.repo.nii.ac.jp:00008466
2022-12-13T02:21:58Z
1:86
Thermally Stable Ag Thin Films Modified with Very Thin Al Oxide Layers
Kawamura, Midori
Inami, Yuuki
Abe, Yoshio
Sasaki, Katsutaka
open access
c 2008 The Japan Society of Applied Physics
Ag thin film
electrode
agglomeration suppression
Al oxide layer
modification
resistivity
Ag has long been of interest for use as a low-resistivity electrode material, but the problem of agglomeration caused by annealing must be resolved. One of the solutions is alloying Ag, but this often causes an increase in electrical resistivity. In this study, thermal stability of Ag thin films modified with thin Al oxide layers was investigated from the viewpoints of surface morphology and resistivity. It was found that agglomeration was suppressed in the multilayer films even after annealing at 600 °C, similarly to Ag(Al) alloy films, which were investigated previously. As a result, it was suggested that the presence of the Al oxide layers at the film surface and interface played a major role in suppressing agglomeration in Ag(Al) films. Moreover, the resistivity of the multilayer film was 1.8 μΩ cm, which was much lower than that of alloy films. Consequently, to achieve both agglomeration suppression and low resistivity, the structural modification of the Ag films using Al oxide layers is more useful than alloying the films.
Japan Society of Applied Physics
2008
eng
journal article
AM
https://kitami-it.repo.nii.ac.jp/records/8466
Japanese Journal of Applied Physics
47
12
8917
8920
https://kitami-it.repo.nii.ac.jp/record/8466/files/No.15-Kawamura.pdf
application/pdf
318.1 kB
2017-01-12