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        <identifier>oai:kitami-it.repo.nii.ac.jp:00007615</identifier>
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          <dc:title xml:lang="en">Time-dependent variation of the target mode in reactive sputtering of Al-O_2 system</dc:title>
          <jpcoar:creator>
            <jpcoar:creatorName xml:lang="en">Abe, Yoshio</jpcoar:creatorName>
          </jpcoar:creator>
          <jpcoar:creator>
            <jpcoar:creatorName xml:lang="en">Shinya, Koji</jpcoar:creatorName>
          </jpcoar:creator>
          <jpcoar:creator>
            <jpcoar:creatorName xml:lang="en">Chiba, Youjiro</jpcoar:creatorName>
          </jpcoar:creator>
          <jpcoar:creator>
            <jpcoar:creatorName xml:lang="en">Kawamura, Midori</jpcoar:creatorName>
          </jpcoar:creator>
          <jpcoar:creator>
            <jpcoar:creatorName>Sasaki, Katsutaka</jpcoar:creatorName>
            <jpcoar:familyName>Sasaki</jpcoar:familyName>
            <jpcoar:givenName>Katsutaka</jpcoar:givenName>
          </jpcoar:creator>
          <dcterms:accessRights rdf:resource="http://purl.org/coar/access_right/c_abf2">open access</dcterms:accessRights>
          <jpcoar:subject subjectScheme="Other">gettering effect</jpcoar:subject>
          <jpcoar:subject subjectScheme="Other">target voltage</jpcoar:subject>
          <jpcoar:subject subjectScheme="Other">chamber pressure</jpcoar:subject>
          <datacite:description descriptionType="Abstract">Reactive sputtering techniques have been widely used for forming compound thin films. In this study, the time-dependent variation of the target mode of an Al-O_2 system was investigated by measuring the target voltage for various reactive O_2 gas flow ratios and presputtering (i.e., sputtering in pure Ar gas to clean the target surface) times. The Al target remains in metallic mode for a certain period of time after being exposed to an Ar-O_2 plasma before it begins to be oxidized. This period increases with decreasing O_2 flow ratio and with increasing the presputtering time. It is considered that the period is caused by the gettering of O_2 gas by Al films deposited on the substrate and the chamber wall during presputtering.</datacite:description>
          <datacite:description descriptionType="Abstract">target surface state</datacite:description>
          <dc:publisher xml:lang="en">Elsevier</dc:publisher>
          <datacite:date dateType="Issued">2010-06</datacite:date>
          <dc:language>eng</dc:language>
          <dc:type rdf:resource="http://purl.org/coar/resource_type/c_6501">journal article</dc:type>
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          <jpcoar:identifier identifierType="URI">https://kitami-it.repo.nii.ac.jp/records/7615</jpcoar:identifier>
          <jpcoar:sourceTitle>Vacuum</jpcoar:sourceTitle>
          <jpcoar:volume>84</jpcoar:volume>
          <jpcoar:issue>12</jpcoar:issue>
          <jpcoar:pageStart>1365</jpcoar:pageStart>
          <jpcoar:pageEnd>1367</jpcoar:pageEnd>
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            <datacite:date dateType="Available">2016-11-22</datacite:date>
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